High aspect ratio sub-15 nm silicon trenches from block copolymer templates.

نویسندگان

  • Xiaodan Gu
  • Zuwei Liu
  • Ilja Gunkel
  • S T Chourou
  • Sung Woo Hong
  • Deirdre L Olynick
  • Thomas P Russell
چکیده

High-aspect-ratio sub-15-nm silicon trenches are fabricated directly from plasma etching of a block copolymer mask. A novel method that combines a block copolymer reconstruction process and reactive ion etching is used to make the polymer mask. Silicon trenches are characterized by various methods and used as a master for subsequent imprinting of different materials. Silicon nanoholes are generated from a block copolymer with cylindrical microdomains oriented normal to the surface.

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عنوان ژورنال:
  • Advanced materials

دوره 24 42  شماره 

صفحات  -

تاریخ انتشار 2012